Document ID:

MIL-HDBK-251       Scroll down to access document images

Overview

Title:  Reliability/Design Thermal Applications Scope:  This handbook recommends and presents electronic parts stress analysis methods which lead to the selection of maximum safe temperatures for parts so that the ensuing thermal design is consistent with the required equipment reliability. These maximum parts temperature must be properly selected since they are the goals of the thermal design, a fact which is often overlooked. Many thermal designs are inadequate because improper maximum parts temperature were selected as design goals. Consequently, the necessary parts stress analysis procedures have been emphasized. Specific step by step thermal design procedures are given in chapter 4. Status:  Active Document Date:  19-JAN-2021         Next Review Due:  18-JAN-2026 FSC/Area:  SESS Doc Category:   Department of Defense Handbook

Responsibilities

Lead Standardization Activity:  SE  Director, Systems Engineering     Preparing Activity: SH  Naval Sea Systems Command (Ship Systems) Coordination:  Full   Army Custodian:  CR   US Army Combat Capabilities Development Command, C5ISR Center   Navy Custodian:  SH   Naval Sea Systems Command (Ship Systems)   Air Force Custodian:  11   Air Force Life Cycle Management Center - Aircraft Systems

Changes to military standards or handbooks issued after August 1, 2003 are incorporated in the modified document.

Revision History

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