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   Data updated: 08 Oct 2025. Home |  About Quick Search |  ASSIST |  ASSIST Updates Document Details
Document ID:   MIL-STD-1310       Scroll down to access document images

Overview
Title:  Shipboard Bonding, Grounding, and other Techniques for Electromagnetic Compatibility, Electromagnetic Pulse (EMP) Mitigation, and Safety
Scope:  This document specifies standard practices to facilitate achievement of the intra-ship and inter-ship electromagnetic compatibility (EMC), electromagnetic pulse (EMP), bonding, and intermodulation interference (IMI) requirements of MIL-STD-464.
Status:  Active Document Date:  12-AUG-2014      
  Next Review Due:  11-AUG-2019
EMCS Doc Category:   Military Standard -Standard Practice  

Responsibilities
Lead Standardization Activity:  DC5  Defense Information Systems Agency (DISA)  
  Preparing Activity: SH  Naval Sea Systems Command (Ship Systems)
Coordination:  Limited  
Navy Custodian:  SH   Naval Sea Systems Command (Ship Systems)  

Changes to military standards or handbooks issued after August 1, 2003 are incorporated in the modified document.
Revision History Click on column headings for a description of column content.
MediaDocument Part DescriptionDist StmtDocument DatePagesSize
Document ImageRevision H Notice 1 - ValidationA12-AUG-201412.0 KB
Document ImageRevision H A17-SEP-200946657.2 KB
Document ImageRevision G A28-JUN-199643783.1 KB
Document ImageRevision F A30-DEC-1992551993.0 KB
Document ImageRevision E A18-AUG-1987521873.3 KB
Document ImageRevision D A08-FEB-1979431299.2 KB

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