Document ID:	MIL-STD-202       Scroll down to access document images
Spec/Std Sheet:	210

Overview

Title:  Method 210, Resistance to Soldering Heat Scope:  This test is performed to determine whether wire and other component parts can withstand the effects of the heat to which they will be subjected during the soldering process (solder iron, solder dip, solder wave, or solder reflow). The heat can be either conducted heat through the termination into the component part, or radiant heat from the solder bath when in close proximity to the body of the component part, or both. The solder dip method is used as a reasonably close simulation of the conditions encountered in wave soldering, in regard to radiated and conducted heat. This test also is intended to evaluate the impact of reflow techniques to which components may be exposed. The heat of soldering can cause solder reflow which may affect the electrical characteristics of the component part and may cause mechanical damage to the materials making up the part, such as loosening of terminations or windings, softening of insulation, opening of solder seals, and weakening of mechanical joints. Status:  Active Document Date:  28-OCT-2024         Next Review Due:  27-OCT-2029 FSC/Area:  59GP Doc Category:   Military Standard -Test Method Standard

Responsibilities

Lead Standardization Activity:  CC  DLA Weapons Support (Columbus)     Preparing Activity: CC  DLA Weapons Support (Columbus) Coordination:  Full   Army Custodian:  CR   US Army Combat Capabilities Development Command, C5ISR Center   Navy Custodian:  EC   Naval Information Warfare Systems Command   Air Force Custodian:  85   Air Force Life Cycle Management Center - Electronic Components, Wire and Ca   DLA Custodian:  CC   DLA Weapons Support (Columbus)

Changes to military standards or handbooks issued after August 1, 2003 are incorporated in the modified document.

Revision History

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