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Document ID:   IPC-2251       Scroll down to access document images

Overview
Title:  Design Guide for the Packaging of High Speed Electronic Circuits
Scope:  The goal in electronic packaging is to transfer a signal from one device to one or more other devices through a conductor. Considerations include electrical noise, electromagnetic interference, signal propagation time, thermo-mechanical environmental protection, and heat dissipation. High-speed designs are defined as designs in which the interconnecting properties affect circuit function and require consideration. Every electrical concept has relevant physical implementation data and limitations provided to match the electrical and mechanical relationships. This guideline presents first order approximations for each of the subject areas covered. If more detail is required, the papers presented in the bibliography may provide more detailed supplemental data. Since most high speed design requires signal integrity and EMI techniques, often field solvers, signal integrity simulation tools, EMI/EMC simulation programs may be required for resolving design challenges. Many PWB layout design tools include these tools as options to their programs. These simulators are driven by SPICE, IBIS, or other models. References to manufacturers of these tools may be found on the IPC Web site (www.ipc.org).
Status:  Active Adoption Date:  14-AUG-2009      
  Next Review Due:  29-SEP-2034
5998 Doc Category:   Association Connecting Electronics Industry  
Reaffirmation Date:  01-OCT-2024

Responsibilities
Lead Standardization Activity:  CC  DLA Weapons Support (Columbus)  
  Adopting Activity: CC  DLA Weapons Support (Columbus)
Coordination:  Full  
Army Custodian:  CR   US Army Combat Capabilities Development Command, C5ISR Center  
Navy Custodian:  EC   Naval Information Warfare Systems Command  
Air Force Custodian:  85   Air Force Life Cycle Management Center - Electronic Components, Wire and Ca  
DLA Custodian:  CC   DLA Weapons Support (Columbus)  

Revision History Click on column headings for a description of column content.
MediaDocument Part DescriptionDist StmtDocument DatePagesSize
Document ImageNotice - Adoption, Tier 2A14-AUG-2009119.2 KB

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