Document ID:	MIL-PRF-19500       Scroll down to access document images
Spec/Std Sheet:	550

Overview

Title:  Semiconductor Device, Diode, Silicon, Fast-Recovery, High Current, Encapsulated (Stud and Surface Mount Packages) and Un-capsulated (Die), Types 1N6304, 1N6305, 1N6306, and R Types, JAN, JANTX, JANTXV, JANS, JANHC, and JANKC Scope:  This specification covers the performance requirements for silicon, high efficiency, fast recovery, switching power rectifier diodes. Three levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500, and two levels of product assurance for each unencapsulated device type die. Status:  Active Document Date:  10-MAY-2021         Next Review Due:  09-MAY-2026 FSC/Area:  5961 Doc Category:   Performance Specification   QPL/QML:  QML-19500-31 NOT 1

Responsibilities

Lead Standardization Activity:  CC  DLA Weapons Support (Columbus)     Preparing Activity: CC  DLA Weapons Support (Columbus) Coordination:  Full   Army Custodian:  CR   US Army Combat Capabilities Development Command, C5ISR Center   Navy Custodian:  SH   Naval Sea Systems Command (Ship Systems)   Air Force Custodian:  85   Air Force Life Cycle Management Center - Electronic Components, Wire and Ca   DLA Custodian:  CC   DLA Weapons Support (Columbus)   Other Custodian:  NA   National Aeronautics and Space Administration (NASA)

Amendments to military specifications or specification sheets issued after August 1, 2003 are incorporated in the modified document.

Revision History

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