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Data updated: 18 Mar 2025.
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Document ID:
J-STD-006
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Overview
Title:
Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications, Requirements for
Scope:
This standard prescribes the requirements and test methods of electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications; and for "special" electronic grade solders.
Status:
Active
Adoption Date:
06-JAN-2021
Next Review Due:
29-DEC-2040
FSC/Area:
3439
Doc Category:
Association Connecting Electronics Industry
Reaffirmation Date:
01-JAN-2031
Responsibilities
Lead Standardization Activity:
GS
DLA Aviation - Richmond
Adopting Activity:
CR
US Army Combat Capabilities Development Command, C5ISR Center
Coordination:
Full
Army Custodian:
CR
US Army Combat Capabilities Development Command, C5ISR Center
Navy Custodian:
EC
Naval Information Warfare Systems Command
Air Force Custodian:
85
Air Force Life Cycle Management Center - Electronic Components, Wire and Ca
Revision History
Click on column headings for a description of column content.
Media
Document Part Description
Dist Stmt
Document Date
Pages
Size
Notice - Adoption, Tier 2
A
06-JAN-2021
1
107.6 KB
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WARNING: UNAUTHORIZED ACCESS TO THIS UNITED STATES GOVERNMENT COMPUTER SYSTEM AND SOFTWARE IS PROHIBITED BY PUBLIC LAW 99-474 (THE COMPUTER FRAUD AND ABUSE ACT OF 1986) AND CAN RESULT IN ADMINISTRATIVE, DISCIPLINARY OR CRIMINAL PROCEEDINGS.