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Document ID:   MIL-HDBK-251       Scroll down to access document images

Overview
Title:  Reliability/Design Thermal Applications
Scope:  This handbook recommends and presents electronic parts stress analysis methods which lead to the selection of maximum safe temperatures for parts so that the ensuing thermal design is consistent with the required equipment reliability. These maximum parts temperature must be properly selected since they are the goals of the thermal design, a fact which is often overlooked. Many thermal designs are inadequate because improper maximum parts temperature were selected as design goals. Consequently, the necessary parts stress analysis procedures have been emphasized. Specific step by step thermal design procedures are given in chapter 4.
Status:  Active Document Date:  19-JAN-1978      
  Next Review Due:  18-JAN-1983
SESS Doc Category:   Department of Defense Handbook  

Responsibilities
Lead Standardization Activity:  SE  ODASD(SE)  
  Preparing Activity: SH  Naval Sea Systems Command (Ship Systems)
Coordination:  Full  
Army Custodian:  CR   US Army Communications Electronics Command  
Navy Custodian:  SH   Naval Sea Systems Command (Ship Systems)  
Air Force Custodian:  11   Air Force Life Cycle Management Center - Aircraft Systems  

Changes to military standards or handbooks issued after August 1, 2003 are incorporated in the modified document.
Revision History Click on column headings for a description of column content.
MediaDocument Part DescriptionDist StmtDocument DatePagesSize
Document ImageBase Document A19-JAN-197869755186.6 KB

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